
NvidiaãšIntelãç±³åœè£œåå°äœãµãã©ã€ãã§ãŒã³ã宣äŒããããã¢ãªãŸãã§è£œé ãããBlackwellãã€ã¯ãã¹ãŠäŸç¶ãšããŠå°æ¹Ÿã§ããã±ãŒãžã³ã°ããã
ä»é±ãNvidiaãšIntelã¯äž¡ç€Ÿãšããç±³åœã«ãããè£œé æ ç¹ã®æ¡å€§ã«ã€ããŠå€§ã çãªçºè¡šãè¡ã£ãããããããã®ç¥è³ã®é°ã«ã¯æ ¹åŒ·ãã®ã£ãããé ããŠãããTSMCã®ãã§ããã¯ã¹å·¥å Žã§è£œé ããããã¹ãŠã®Blackwellãããã¯ãé«åºŠãªããã±ãŒãžã³ã°ã®ããã«ããŸã ã«å€ªå¹³æŽãæž¡ããªããã°ãªããªãã®ã ã Nvidiaã®ç±³åœã«ãããããŒãããŒããã³ãµãã©ã€ã€ãŒã®ãããã¯ãŒã¯ã¯çŸåš43å·ã«åã¶ãšãCEOã®ãžã§ã³ã¹ã³ã»ãã¢ã³æ°ã7æ2æ¥ã®ããã°æçš¿ã§è¿°ã¹ãŠãããTSMCã®ã¢ãªãŸãå·¥å Žã¯BlackwellãŠã§ããéç£ããŠãããFoxconnã¯ãã¥ãŒã¹ãã³ã«AIã¹ãŒããŒã³ã³ãã¥ãŒã¿çµç«å·¥å Žã建èšäžã§ãWistronããã©ã¹ã«åæ§ã®å·¥å Žã建èšããŠãããNvidiaã¯ãå瀟ã®AIã€ã³ãã©æè³ã2026幎ã ãã§ç±³åœGDPã«4850åç±³ãã«ïŒçŽ3850åè±ãã³ãïŒè²¢ç®ãããšèŠç©ãã£ãŠããã ãããããã®ããã°æçš¿ã¯ããµãã©ã€ãã§ãŒã³ã¢ããªã¹ãã«ãã£ãŠç¢ºèªãããé倧ãªè©³çްãçç¥ããŠãããCoWoSïŒChip-on-Wafer-on-SubstrateïŒå é²ããã±ãŒãžã³ã°ïŒGPUãã€ãšé«åž¯åã¡ã¢ãªãã·ãªã³ã³ã€ã³ã¿ãŒããŒã¶äžã§çµåããããã»ã¹ïŒã¯ãå°æ¹Ÿã§ã®ã¿å®è¡ãããŠãããã¢ãªãŸãã§è£œé ããããã¹ãŠã®ãŠã§ãã¯ãæ©èœçãªBlackwellã¢ã¯ã»ã©ã¬ãŒã¿ãšãªãåã«ãTSMCã®å°äžã«ããCoWoSã©ã€ã³ã«éãè¿ãããªããã°ãªããªãã®ã ã ããã±ãŒãžã³ã°ã®ããã«ãã㯠å é²ããã±ãŒãžã³ã°ã¯ããŠã§ã補é ã«ä»£ãã£ãŠAIãããäŸçµŠã®å¶çŽèŠå ãšããŠæµ®äžããŠãããNvidiaã¯å°ãªããšã2027幎ãŸã§TSMCã®CoWoS容éã®å€§éšåã確ä¿ããŠãããããã®å®¹éã¯å¹ŽéçŽ80ïŒ ã®è€å©ã§æé·ããŠãããã®ã®ãéèŠã«ã¯äŸç¶ãšããŠåã°ãªããšã4æã®CNBCå ±éãäŒããŠããã TSMCã¯ãç±³åœãžã®1650åç±³ãã«ïŒçŽ1310åè±ãã³ãïŒã®æ¡å€§ã³ãããã¡ã³ãã®äžç°ãšããŠãã¢ãªãŸãã«2ã€ã®å é²ããã±ãŒãžã³ã°æœèšã建èšäžã§ãããããããã®å·¥å Žã¯ãŠã§ãå·¥å Žãããé ã建èšã¹ã±ãžã¥ãŒã«ã«äœçœ®ããŠããããããŸã§ã®éãå°æ¥ã®ãããã«ã€ããŠNvidiaã®ç±³åœããã±ãŒãžã³ã°äºæ¥ãç²åŸããAmkor Technologyã¯ãããŸã ã«TSMCã®å°æ¹Ÿã©ã€ã³ãšã®çç£åçæ§ãéæããŠããªãã Intelã¯åžå Žã«å¯ŸããŠç¬èªã®ã¡ãã»ãŒãžãæã£ãŠãããå瀟ã®18Aããã»ã¹ããŒãã¯ãè£é¢çµŠé»ã«ãã30ïŒ é«ãåšæ³¢æ°ãå®çŸããŠãªã¹ã¯çç£ã«å ¥ã£ãŠãããå瀟ã®ãã¡ãŠã³ããªäºæ¥ã¯CoWoSã®ä»£æ¿ãšããŠEMIBïŒEmbedded Multi-die Interconnect BridgeïŒããã³Foveros 3Dããã±ãŒãžã³ã°ãæäŸããŠãããããããIntelã®ããã±ãŒãžã³ã°æè¡ã¯ãŸã Nvidiaã®Blackwellã¢ãŒããã¯ãã£ã«èªå®ãããŠãããã2025ã2026幎ã«ãããŠã®ãã¡ãŠã³ããªã®åºç¯ãªéçšäžã®èª²é¡ïŒååã«ææžåãããæ©çãŸãã®åé¡ãå«ãïŒããå€éšé¡§å®¢ã®ä¿¡é Œãå¶éããŠããã å°ççéäžã®åé¡ åå°äœæ¥çã®å°ççãªè匱æ§ã¯ããã±ãŒãžã³ã°ãè¶ ããŠåºãã£ãŠããã2022幎ã®ç±³åœCHIPSæ³ã¯çç£ã®åœå ååž°ã®ããã«çŽ520åç±³ãã«ïŒçŽ410åè±ãã³ãïŒã®å©æéãšçšé¡æ§é€ãæ¿èªããããè³éã¯äž»ã«åå·¥çšã®è£œé ã«éç¹çã«é åããããTSMCãæ¯é ããè³æ¬éçŽçã§æè¡çã«å³ããããã»ã¹ã§ããå é²ããã±ãŒãžã³ã°ã«ã¯ãã¯ããã«å°ãªãæè³ããè¡ãããªãã£ãã Nvidiaèªèº«ã宣èšããéå¿ã¯ãã®ã®ã£ãããæµ®ã圫ãã«ããŠãããå瀟ã¯ãTSMCãFoxconnãWistronãCorningãLumentumãCoherentãAmkorãªã©ã®ããŒãããŒãšãšãã«ãæå€§5000åç±³ãã«ïŒçŽ3970åè±ãã³ãïŒã®AIã€ã³ãã©ãç±³åœã§çç£ãããšè¿°ã¹ãŠãããããããè€æ°ã®ã¢ããªã¹ããææããŠããããã«ããã¹ãŠã®Blackwellããããå°æ¹Ÿã§ããã±ãŒãžã³ã°ãããªããã°ãªããªãã®ã§ããã°ããã®æ°åã¯åäžã®å°ççãªãã§ãŒã¯ãã€ã³ãã«äŸåããŠããããšã«ãªãã ããããŸã§ã®ãšãããTSMCã®å é²ããã±ãŒãžã³ã°å®¹éã¯ãã¹ãŠå°æ¹Ÿã«ãããå°ãªããšãä»åŸ2幎éã¯ããã«çãŸãã§ãããããšãåå°äœã¢ããªã¹ãã®ãã³ã»ããããœã³æ°ã¯4æã«CNBCã«èªã£ãããã¢ãªãŸãã®ããã±ãŒãžã³ã°å·¥å Žã¯æ¥ãŠããŸããããŸã ããã«ã¯ãªããã¹ã±ãŒãªã³ã°ã®èª²é¡ã¯èšãç¥ããŸãããã Intel Foundry Servicesã¯ãå°æ¹Ÿä»¥å€ã§ã®å é²ããã±ãŒãžã³ã°ã®æœåšçãªã»ã«ã³ããœãŒã¹ãšããŠèªããäœçœ®ã¥ãããã¥ãŒã¡ãã·ã³å·ãªãªã©ã³ãã§ã®æœèšã§èœåãæäŸããŠãããããããIntelèªèº«ã®è²¡ååç·šãé²è¡äžã§ããã顧客èªå®ã®ã¿ã€ã ã©ã€ã³ã2027幎ãŸã§å»¶ã³ãŠããäžãããã±ãŒãžã³ã°ã«ãããæ¥çã®å°æ¹ŸäŸåã10幎å€ããåã«ææã«å€åããå¯èœæ§ã¯äœãã åºå ž: NVIDIA and Partners Build in America, for AmericaïŒNvidiaããã°ã7æ2æ¥ïŒ; Nvidia and Intel tout homegrown American chip supply chainïŒTom’s Hardwareã7æ6æ¥ïŒ; TSMC Advanced Packaging Bottleneck: Why CoWoS Controls AI Chip SupplyïŒNext Waves Insightã4æ26æ¥ïŒ; Intel 18A-P enters risk productionïŒTom’s [âŠ]










